Magnobond 3360 A/B is an unfilled epoxy system for encapsulating electronic circuitry in a sand-filled aluminum container. At 85°C, this system is extremely fluid and will replace the air from the unit. The low surface tension of Magnobond 3360 promotes easy bubble breaking and generally provides a slick appearance to the top surface of the fully cured unit. This system will stretch under thermal or mechanical stress so that repeated thermal shocks (from +125°C to –40°C) do no harm to either the electrical functionality or the mechanical integrity of properly potted products. Magnobond 3360 A/B has a mix ratio of 1:1 by volume, which makes automatic metering, mixing and dispensing equipment ideally suited for processing this system. Never cure volumes of even 100 grams above 100°C, since gelation at too high a state of molecular activity can force the system to separate from the housing during cooling or, to fail during changes in temperature under service conditions.